Durability Metal Construction IPX17 Middle Layer Reballing Platform Set For 17Air/17Pro Repair Fixture Tool Middle Layer Reballing Platform

Durability Metal Construction IPX17 Middle Layer Reballing Platform Set For 17Air/17Pro Repair Fixture ToolFeatures:The IPX17 Middle Layer ensures millimeter levels precise for 17Air repairs, featuring an IPX17 alignment systems that eliminates positioning errors common in traditional reballing tools.Crafted from premium grade metal with a steel meshes template, this set universally compatibility across Phone17 models while maintaining structural rigidity for repeated high temperature applications.Professional repair technicians and electronics enthusiasts will appreciate the easy assembly design, enabling swifting deployment in fast paced workshops or home based microsoldering stations for intensive repair environments, the platform's nonslip base and components streamlines chip reballing procedures for mobile device restoration specialists.Engineered to reduce solder bridging risks, the reinforced steel meshes maintains consistent pastes distribution across boards, significantly improving first attempt success rates during Phone motherboard repairs.Specifications:Component: MetalSize:Approx.100x60mm/3.93x2.36inchSuitable for 17Air/17ProPackage Includes:Package A1pc Positioning plate1pc Magnet base3pcs IP17 Middle Layer 2pcs IP16 Middle Layer 3pcs IP15 Middle Layer 2pcs IP14 Middle Layer 4pcs IP13 Middle Layer 3pcs IP12 Middle Layer 4pcs IP11 Middle Layer Package B1pc Positioning plate1pc Magnet base3pcs IP17 Middle LayerPackage C1pc IP17 Middle LayerNote:Please allow 1-3cm errors due to manual measurement. Due to the differences between different monitors, the picture may not reflect the actual item color.

• Professional repair technicians and electronics enthusiasts will appreciate the easy assembly design, enabling swifting deployment in fast paced workshops or home based microsoldering stations
• The IPX17 Middle Layer ensures millimeter levels precise for 17Air repairs, featuring an IPX17 alignment systems that eliminates positioning errors common in traditional reballing tools
• Engineered to reduce solder bridging risks, the reinforced steel meshes maintains consistent pastes distribution across boards, significantly improving first attempt success rates during Phone motherboard repairs
• for intensive repair environments, the platform's nonslip base and components streamlines chip reballing procedures for mobile device restoration specialists
• Crafted from premium grade metal with a steel meshes template, this set universally compatibility across Phone17 models while maintaining structural rigidity for repeated high temperature applications