New
Arrivals/Restock
CU31-2030 One-Component Capillary Underfill
5.0 (113 items)
Limited Time SaleUntil the end
20
40
06
US$54.00 cheaper than the new price!!
Free shipping for purchases over $99 ( Details )
Free cash-on-delivery fees for purchases over $99
Free cash-on-delivery fees for purchases over $99
See all stores
Please note that the sales price and tax displayed may differ between online and in-store. Also, the product may be out of stock in-store.
Used US$36.00
Product details
| Management number | 211006868 | Release Date | 2026/04/04 | List Price | US$36.00 | Model Number | 211006868 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
ALPHA HiTech CU31-2030 is a single-component capillary underfill, designed to safeguard assembled chip packages on printed circuit boards. It boasts low viscosity, ensuring swift and efficient flow. Moreover, it features a high Tg and low modulus, leading to superior reliability. This product is ideal for assembling BGA, CSP, and Flip Chip devices.
- Low Viscosity: Enables Fast Flow
- Flows at Room Temperature
- High Glass Transition Temperature
- Low Elastic Modulus
- Can Be Reworked
- Ensures Excellent Reliability
- Halogen-Free, Compliant with RoHS Directive
| Brand Name | ALPHA HiTech |
|---|---|
| Manufacturer | ALPHA HiTech |
| Cooling Method | forced air |
| Compatible Devices | Desktop, Laptop |
| Power Connector Type | 3-Pin or 4-Pin |
Bestseller ranking
Cookware Sets
Customers who viewed this product also viewed
Capillary Tubes
Correction of product information
If you notice any omissions or errors in the product information on this page, please use the correction request form below.
Correction Request Form